Believe it or not – one of the easiest Teardown’s we’ve performed to date! The device is built well, and easily dissasembled – vast improvements over previous attempts (AHEM OMNIA).
We admit, it hurt a bit to take this thing apart – it’s such a nice device.
First step is to remove the backcover and Battery. This can be done by prying away the plastic at the base of the backside of the device.
Next, grab your trusty and super small phillips head screw driver. There are 6 screws to remove here:
That’s about it. Now it’s up to your spudger or staple remover to seperate the black plastic casing from the chrome bevel.
Plastic clips keep this all in place. Be careful, if you break them the device will be flimsy and loose upon re-build. You should now be able to separate the two halves and reveal the PCB!
There’s a variety of flex cables to pry away. These cables keep the PCB in place which we consider a clever design to eliminate the use of metal or plastic fasteners.
And thar she blows! The PCB assembly should drop into your hands.
This device was clearly built with space constraints and weight in mind. Instead of expanding the PCB into the battery section, a separate PCB that houses the SD and SIM card slot is mounted to the top of the ESD shields. These effectively smother the communication devices on the main logic board.
In true fashion, we had to keep digging. The ESD shields can be removed by prying back the small metal tabs shown here.
Once pulled away, the real meat is revealed…
Now, let’s identify what devices are on the board!
My my my, you may notice some significant similarities to the iPhone 4. At the centre of the diagram, the Samsung “Hummingbird” S5PC110A01 applications core reins supreme. There’s been plenty of debate that this is the die hiding underneath Apple’s A4 skin – it’s hard to say. One thing for certain, this device kicks arse. Capable of assembling ~90 million triangles/second, penetration of this processor will only make smartphone gaming a more immersive experience.
Similar to the iPhone, Samsung chose an Infineon baseband. The YYN1N7438A8 to be exact. The baseband wasn’t infineon’s only win, coming in with the PMB 5703 SMARTi UE transceiver as well.
Not surprisingly, Samsung has kept things consistent with just about every other phone and provided itself with the memory wins. The K4X1G323B, KLM8G4DEDD and K4X2G323PB represnt the 1Gb DDR SDRAM, 8Gb Managed NAND and 2Gb DDR SDRAM respectively.
Communications are literally monopolized by Triquint. We’ve got a duplexer (TQM6M26028L) a transmit module (TQM69014), and two power-amps TQM676021 and TQM666022.
Wi-Fi and Bluetooth communications are handled by the same MCP/combo device that we found on the iPhone 4, the Broadcomm BCM4329FKUBG. Broadcomm also has the GPS win with the BCM4751.
Audio Codec goes to Wolfson (WM8994E), Camera Controller to NEC (MC-10170), Touch Screen Controller to Atmel (MX1224) and PMIC to Maxim with the MAX8998.
And that’s all she wrote! If you have any questions, feel free to post them in the comments section! Until next time, happy wrecking!